Vol. 48, No. 6, 2019
Creation and Development of the Ion Beam Technology
p. 347 abstract
Parameters of Plasma and Way of Etching Silicon in a CF4 + CHF3 + O2 Mixture
p. 364 abstract
Simulation of the Effect of the Grain Boundary Structure on Effective Ionic Charges in the Processes of Electromigration
p. 373 abstract
Modeling the Charge Collection from a Track of an Ionizing Particle in Upset Hardened CMOS Trigger Elements
p. 381 abstract
Modeling the CMOS Characteristics of a Completely Depleted Surrounding-Gate Nanotransistor and an Unevenly Doped Working Region
p. 394 abstract
Effect of the Pressure of Oxygen on the Plasma Oxidation of the Titanium Nitride Surface
p. 402 abstract
Estimating the Electric Mode Effect (Active and Passive) on the Dose of Radiation Resistance of Microcircuits
p. 409 abstract
Method for Determining the Most Sensitive Region of an Optocoupler Chip under X-ray-Induced Dose Effects
p. 415 abstract
Charge Transport in Layer Gallium Monosulfide in Direct and Alternate Electric Fields
p. 422 abstract
A Novel Parameter Identification Approach for C–V–T Characteristics of Multi-Quantum Wells Schottky Diode Using Ant Lion Optimizer
p. 428 abstract