Vol. 54, No. 2, 2025
Regularities of X-ray Transfer in Doped Multicomponent Semiconductors for Dosimetry
p. 97 abstract
Precise Etching of Aluminum Conductors in the Technology of Switching Devices of Microsystem Engineering
p. 115 abstract
Spectroscopy and Actinometry of Halogen-Containing Inductively Coupled Plasma for Anisotropic Etching
p. 122 abstract
Multilevel Switching in Memristive Structures Based on Oxidized Lead Selenide
p. 131 abstract
Ferroelectric Transistors: Operating Principles, Materials, and Applications
p. 140 abstract
Electrical Characteristics of Ruthenium Tracks with a Cross-Sectional Area Less Than 1000 nm2
p. 156 abstract
Effect of Boundary Roughness on the Variability of the VAC of Silicon Field-Effect GAA Nanotransistors
p. 169 abstract
Measuring the Adhesion Energy between MEMS Structures Using an Adhered Cantilever
p. 177 abstract
Loss Analysis of T-Type Three-Level Inverter Based on SiC/GaN Device
p. 187 abstract
Impact of Self-Heating in Si/SiGe HBTs with Multi-Finger Emitters
p. 200 abstract
Investigation of Deposition Rates in Bilayer Silicon Nitride Structures Using Ellipsometry and the Maxwell Garnett Model
p. 208 abstract