Contents
Russian Microelectronics

Vol. 34, No. 1, 2005

Simultaneous English language translation of the journal is available from MAIK “Nauka / Interperiodica” (Russia).
Distributed worldwide by Springer Science+Business Media, Inc. Russian Microelectronics ISSN 1063-7397.

Materials and Microstructure Characterization

Noncontact Temperature Measurement on Dielectrics
and Semiconductors, Part 2

V. K. Bitukov and V. A. Petrov p. 1  abstract

Short-Circuited Double Langmuir Probe as a Model
of a Conducting Wafer under Plasma Processing

A. F. Aleksandrov, V. A. Riaby, V. P. Savinov, and V. G. Yakunin p. 18  abstract

Parts Screening for ESD Susceptibility

M. I. Gorlov, V. A. Emel’yanov, I. I. Rubtsevich, and D. Yu. Smirnov p. 22  abstract

Process Technologies

MBE Growth of Silicon Films on Diamond Substrates

V. Y. Karasev, V. D. Kryukov, M. G. Kuznetsov, S. M. Pintus, M. A. Lamin,
O. P. Pchelyakov, and L. V. Sokolov p. 30  abstract

Defect Formation in Epitaxial GaP Junctions under Heat Treatment

S. V. Boulyrskii, N. S. Groushko, and D. V. Kazakov p. 36  abstract

Combined Effect of V₂O₅ and NH₃ on Thermal Oxidation of InP

I. Ya. Mittova, S. S. Lavrushina, and M. V. Sycheva p. 43  abstract

Micro- and Nanoelectronic Devices

Magnetic Nanostructures and Nanodevices with a Semiconductor or Dielectric Spacer

S. I. Kasatkin, A. M. Murav’jev, N. V. Plotnikova, F. A. Pudonin,
L. A. Azhaeva, Z. N. Sergeeva, and V. D. Khodzhaev p. 47  abstract

MOS Integrated Piezoresistive Microsensors

V. P. Dragunov p. 54  abstract

Circuit Analysis and Synthesis

Microprocessor Structure in Relation to On-Chip Interconnection Characteristics

G. V. Kristovskii and Yu. I. Terent’ev p. 61  abstract

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