Contents

Surface Engineering and Applied Electrochemistry

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Vol. 60, No. 3, 2024

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Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 269  abstract

Chapter 2. Materials for Building Electrical Connections

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 289  abstract

Chapter 3. Solderability of Materials and Electronic Components

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 317  abstract

Chapter 4. Physicochemical Foundations of Electric Mounting Soldering

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 332  abstract

Chapter 5. Assembly and Mounting of Electronic Modules on Printed Circuit Boards

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 342  abstract

Chapter 6. Surface Mount Assembly of Electronic Modules

V. L. Lanin, V. A. Emel’yanov, and I. B. Petukhov p. 374  abstract

Chapter 7. Technology for the Assembly and Mounting of Micromodules

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 408  abstract

Chapter 8. Assembly and Mounting of Microwave Micromodules and Microblocks

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 454  abstract

Chapter 9. Ultrasonic Soldering and Metallization in Electronics

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 463  abstract

Chapter 10. High-Frequency Soldering Technology in Electronics

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 492  abstract

Chapter 11. Laser Soldering of Electronic Modules

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 508  abstract

Chapter 12: Microassembly of Integrated Circuits and Micromodules

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 520  abstract

Chapter 13. Sealing of Integrated Circuits and Microblocks

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 553  abstract

Chapter 14. Interblock Mounting of Electronic Equipment

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 567  abstract

Chapter 15: Quality Control of Assembly and Mounting

V. L. Lanin, V. A. Emel’yanov, and I. B. Petuhov p. 572  abstract

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