Glass Physics and Chemistry. Vol. 51, No. 2, Pages 233-241, 2025

V. I. Voshchikov^a^,*, Ya. A. Khamidulin^a, L. N. Krasilnikova^a, T. V. Khamova^a, S. N. Stepin^b, G. S. Sokolov^a, A. G. Ivanova^a, and O. A. Shilova^{a, c}^,**

^aKonstantinov St. Petersburg Institute of Nuclear Physics–Grebenshchikov Institute of Silicate Chemistry, National Research Centre “Kurchatov Institute,”, St. Petersburg, 199034 Russia

^cSt. Petersburg State Electrotechnical University “LETI”, St. Petersburg, 197022 Russia

Abstract— This article presents the results of a study on protective, dielectric, and thermally resistant organosilicate coatings (OSCs) based on a ladder polymer, polyphenylsilsesquioxane (PPSQ), which is used as a film-forming agent. For the first time, a classical approach is employed to calculate the formulations of pigmented coatings in relation to organosilicate compositions (OSComps). The average viscosity molecular weight of the selected film-forming agent PPSQ is determined. The developed coatings exhibit high thermal resistance up to 420°C while maintaining the necessary physicomechanical and electrophysical properties.

Keywords: organosilicate compositions, protective coatings, viscosimetry, thermal resistance, physicomechanical properties, electrophysical properties

Optimization of the Composition of a Thermally Resistant Dielectric Organosilicate Coating Based on Ladder Polymer Polyphenylsilsesquioxane