Kinetics of Intermetallic Layer Formation between Nickel
and Bismuth

O. V. Duchenko and V. I. Dybkov

Institute of Problems in Materials Science, National Academy of Sciences of Ukraine, Kiev, Ukraine

Received July 20, 1995

Abstract—A NiBi₃ layer is formed at the nickel–bismuth interface at 150–250°C. Bismuth is the major
diffusing component in the growing layer. Within 1–300 h, the kinetics of layer growth is described by a
parabolic law. The temperature dependence of the rate constant for layer growth obeys the Arrhenius
equation.

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