Adhesive and Electrical Properties of the Interface
between Pb
1 frame0 xMnxTe Crystals and Inframe1Agframe2Au Alloy

T. D. Alieva, G. J. Abdinova, N. M. Akhundova, and D. Sh. Abdinov

Institute of Physics, National Academy of Sciences, Azerbaijan, Baku

e-mail: aliyevat@yahoo.com

Received October 8, 2007

Abstract—The effect of annealing of Pb1–xMnxTe crystals at ~690 K and structures on their basis at ~383 K
on the adhesive and electric properties of the interface in the Pb1–xMnxTe–(In–Ag–Au) structure was studied
over the temperature range ~77frame3300 K. The contacts possessed high adhesive strength. The effect of annealing
on contact resistance rc was determined by a change in the specific resistance of crystals, diffusion of Ag atoms
into the near-contact area of crystals, and the formation of intermediate phases of the Ag2Te type at the inter-
face.

DOI: 10.1134/S0036024408110319


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