A. V. Rudneva, E. B. Molodkinaa, M. R. Ehrenburga, R. G. Fedorova, A. I. Danilova,z,
Yu. M. Polukarova, and J.M. Feliub
aFrumkin Institute of Physical Chemistry and Electrochemistry, Russian Academy of Sciences, Moscow, Russia
bInstitute of Electrochemistry, University of Alicante, Alicante, Spain
Received December 22, 2008
Abstract—Technique of modification of basal faces Pt(hkl) by adatoms and epitaxial copper deposits is devel-
oped. Analysis of potentiostatic current transients of copper deposition/dissolution and atomic force micros-
copy showed that the activity of Pt(hkl) faces regarding the processes of copper nucleation and epitaxial growth
increases in the sequence of Pt(111) < Pt(110) < Pt(100). The reaction of nitrate anion reduction is sensitive
towards the surface structure, not only in the case of platinum, but also in the case of copper deposits (including
a monolayer of adatoms). The highest process rate is observed for the Pt(100) electrode modified by a mono-
layer of adatoms or islands of bulk copper; nitrate reduction at the lowest rate occurs at Pt(111) + Cu electrodes.
Structure–sensitive competitive adsorption of background electrolyte and nitrate anions is the factor that largely
determines the kinetics of nitrate reduction on different faces of platinum single crystal and copper deposits.
Key words: Pt(hkl), modified electrodes, copper, nitrate
DOI: 10.1134/S1023193509090110
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