The Near-Electrode Layer Composition and Diffusion
Polarization Inherent in Electrolysis of Copper-plating
Cyanide Solutions with a Mild Excess of the Ligand

R. Yu. Bek and L. I. Shuraeva

Institute of Solid State Chemistry and Mineral Processing, Siberian Division, Russian Academy of Sciences,
ul. Derzhavina 18, Novosibirsk, 630091 Russia

Received April 3, 1995

Abstract—Regularities that govern changes in concentrations of all the species present in a cuprous-cyanide
solution and diffusion polarization are studied as a function of the j/jd ratio, where jd represents the limiting dif-
fusion current density. The study covers the 1 to 0.001 M range of the copper ion concentrations c2 , with the
c
1/c2 ratio varying from 2.2 to 8. The regularities inherent in copper deposition from cyanide solutions are
shown to be strongly affected by diffusion polarization, whose influence grows with the increasing concentra-
tion of the cuprous-cyanide salt and the decreasing cyanide concentration. Comparing calculations of diffusion
polarization with the experiment reveals that, in addition to slow diffusion, the electrode process involves other
slow stages.


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