Alloying during Codeposition of Copper
and Tin out of Silicofluoride Electrolytes

O. V. Reva^z, T. N. Vorobyova, and B. V. Kuznetsov

Research Institute of Physicochemical Problems, Belarussian State University, Minsk, Belarus

Received February 7, 2005

Abstract—A technique for obtaining binary Cu–Sn alloys containing 20–35 mol % Sn is proposed. The tech-
nique—the electrochemical deposition out of silicofluoride electrolytes—ensures a high deposition rate of coat-
ings (25–50 m h^–1). The formation of intermetallic compound Cu₁₀Sn₃ is found to occur at a high current den-
sity, in conditions of the tin reduction depolarization and the copper reduction superpolarization. The alloys
consist of submicron grains. Apart from crystalline Cu₁₀Sn₃, they include x-ray-amorphous tin (2–12 mol %)
and tin oxides (1–3 mol %). The alloys feature high hardness (4200 MPa), corrosion resistance, and solder-
ability.

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