A Study on Electroplating of Zinc Nickel Alloy
with HEDP Plating Bath*

Z.-L. Wang^a, Y.-X. Yang^b,d,z, J.-B. Zhang^c, H. Zhu^b, and Y.-R. Chen^b

^a College of Applied Technology, Wenzhou University, 325035, P.R. China
^b School of Chemistry and Pharmaceutics, East China University of Science and Technology, 200237, P.R. China
^c College of Environmental Sciences, Peking University, Beijing, 100871, P.R. China
^d Coordination Chemistry Institute, Nanjing University, Nanjing 210093, P.R. China

Received March 14, 2005

Abstract—The electroplating of bright Zn–Ni alloy process using HEDP as coordinating agent, ZNP as addi-
tive agent is studied. The effect of coordinating agent, chloride content, [Zn²⁺]/[Ni²⁺], cathode current density,
temperature, and supplementary coordinating agent on Ni content is investigated; composition and physical
phase of alloy plating layer, brightness of plating layer, and stability of plating solution are comprehensive con-
sidered; and also, the optimum composition of plating solution for bright Zn–Ni alloy electroplating and tech-
nological condition is determined; finally, deposition mechanism is discussed.

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